1/5 www.asb.co.kr february 2009 plerow tm APM0866-P29 high oip3 medium power amplifier module specifications parameter unit min typ max frequency range mhz 865 868 gain db 31 32 gain flatness db 0.2 0.3 noise figure db 6.6 6.8 output ip3 (1) dbm 44 47 s11 / s22 (2) db -15 / -9 output p1db dbm 28 29 switching time (3) sec - supply current ma 370 400 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 23 ~ 25 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is -40 c to +85 c. 1) oip3 is measured with two tones at an output power of 12 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 2 rf in 5 rf out 6 vs others ground features note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding considerations. 2. we recommend that the ground via holes be placed on the bottom of all ground pins fo r better rf and thermal performance, as shown in the drawing at the left side. website: www.asb.co.kr e-mail: sales@asb.co.kr tel: (82) 42-528-7223 fax: (82) 42-528-7222 asb inc., 4th fl. venture town bldg., 367-17 goijeong-dong, seo-gu, daejon 302-716, korea more information 1-stage single type s 21 = 32.2 db @ 865 mhz = 31.8 db @ 868 mhz nf of 6.6 db over frequency unconditionally stable single 5v supply high oip3 @ low current description s 21 = 32.2 db @ 865 mhz = 31.8 db @ 868 mhz nf of 6.6 db over frequency unconditionally stable single 5v supply high oip3 @ low current typ. @ t = 25 c, v s = 5 v, freq. = 866.5 mhz, z o.sys = 50 ohm specifications (in production) a pm0866-p29 a sb inc. (top view) solder stencil area ? 0.3 plated thru holes to ground plane (side view) 2 x ? 2.0 plated thru holes to screw on heat sinker (recommended footprint) (bottom view) plerow outline drawing (unit: mm) the plerow tm apm-series is an internall y matched amplifier mini-module for such application band in smd packa g e with the output p1db of 29 dbm. it is compactly designed for low current consumption and hi g h oip3. inte g ratin g all the components for biasin g and matching within the module enhances production yield and throughput as well. it passes throu g h the stringent dc, rf, and reliability tests. not sample test but 100% quality control test is made before packing.
2/5 www.asb.co.kr february 2009 plerow tm APM0866-P29 high oip3 medium power amplifier module s-parameters oip3 p1db 865~868 +5 v stability factor (k) typical performance (measured) noise figure
3/5 www.asb.co.kr february 2009 plerow tm APM0866-P29 high oip3 medium power amplifier module output channel power (@ aclr=-45dbc, +/-5mhz offset) ** test source : agilent e4433b (3gpp w-cdma test model-1 64dpch) oip3 vs output power (@ 1mhz offset, 1-tone power) aclr vs channel power
4/5 www.asb.co.kr february 2009 plerow tm APM0866-P29 high oip3 medium power amplifier module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer?s dc supply status. the ca- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance. 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are in- cluded inside the apm module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application frequency. application circuit recommended soldering reflow process 20~40 sec 260 c 200 c 150 c 60~180 sec ramp-up (3 ? c/sec) ramp-down (6 c/sec) + - apm out in c1 c2 v s tantal or mlc (multi layer ceramic) capacitor in out vs evaluation board layout size 40x40mm ( for apm series ? 10x10mm )
5/5 www.asb.co.kr february 2009 plerow tm APM0866-P29 high oip3 medium power amplifier module channel power vs. aclr test configuration a pm0866 ? p29 evaluation board attached with heat sink e va l ua ti on b oar d * in order to prevent damage of d.u.t (apm-series ) from heatin g , y ou must to use a properl y sized hea t sink for testing a module.
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